| 11. | "' Flip chip "'is a method of flipping over the chip to connect with either substrate or leadframe.
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| 12. | An upgrade to the Flip Chip led to the R series, which in turn led to the PDP-7A in 1965.
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| 13. | MIL-STD-883 methods 2011.9 destructive bond pull test and 2031.1 flip chip pull off test apply, as well as JEDEC JESD22-B109.
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| 14. | The Low Cost Flip Chip Consortium was one of 10 cooperative research consortia announced December 6 by the Justice Department.
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| 15. | Some boards containing flip chip modules were etched and drilled to allow those modules to be replaced by discrete components.
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| 16. | In 1964 DEC introduced its new Flip Chip module design, and used it to re-implement the PDP-4 as the PDP-7.
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| 17. | DEC continued to hold the " flip chip " trademark until June 6, 1987, when the trademark was allowed to expire.
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| 18. | Today, flip chip is a well established technology and collapsed soft solder connections are used in the vast majority of assemblies.
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| 19. | Figure 2 is a photo of EN plated bumps on a flip chip, something impossible to accomplish with an electroplated deposit.
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| 20. | On 22 March 1965, DEC introduced the PDP-8, which replaced the PDP-5's modules with the new R-series modules using Flip Chips.
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