| 11. | 9 is the upper and lower specification limits for individual solder paste height measurements also defined
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| 12. | Solder paste , screen printing , use ways , printing process course will decide the printing quality
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| 13. | In this process , a standard stencil printing technique is used to print solder paste directly onto silicon wafers ( figure 4 )
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| 14. | Figure 5 . transfer efficiency of a solder paste related to aperture area ratio and its effect on reflowed bump co - planarity
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| 15. | Lf305a is designed for widely electronic assembly applications . it is a lead - free , mildly active solder paste
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| 16. | We should judge the adhibit of solder paste before screen printing by automatic machine or by hand
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| 17. | Solder paste is applying for the connection between the mount components foot and pcb pads in the smt assembly
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| 18. | Attachment materials for electronic assembly - requirements for solder pastes for high - quality interconnections in electronic assembly
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| 19. | More than 3 years working experiences in smt processing and strong willing to be a technical sales in selling lead - free solder paste
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| 20. | More than 5 years working experiences in smt process . familiar with technical , equipment , process of lead - free solder paste
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