Simple changes to device architecture spin coating a thin layer of PCBM on top of the P3HT greatly enhance cell reproducibility, by providing reproducible vertical separation between device components.
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However each method has certain draw backs, spin coating technique can coat larger surface areas with high speed but the use of solvent for one layer can degrade the already existing polymer layer.
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By spraying the photoresist onto the surface of the wafer as opposed to spin coating the photoresist you save a lot of photoresist, and are able to make smaller and more precise parts.
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Spin coating or spin casting, uses a liquid precursor, or sol-gel precursor deposited onto a smooth, flat substrate which is subsequently spun at a high velocity to centrifugally spread the solution over the substrate.
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One common type of combustion synthesis is spin coating, which involves depositing In and Ga solution layers onto a hot plate and annealing at temperatures roughly between 200 and 400 degrees C, depending on your target composition.
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Traditional methods of building nanostructured materials ( like spin coating ) can't form GML nanostructures, while more effective methods like Atomic Layer Deposition ( ALD ) or Langmuir-Blodget " microchemical " method . are expensive.
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Bulk heterojunctions are most commonly created by forming a solution containing the two components, casting ( e . g . drop casting and spin coating ) and then allowing the two phases to separate, usually with the assistance of an annealing step.
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This has been demonstrated for poly-3-hexyl thiophene ( P3HT ), phenyl-C 61-butyric acid methyl ester ( PCBM ) devices where the PCBM tends to accumulate towards the device's bottom upon spin coating from ODCB solutions.
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Specific facilities are a clean room for thin film deposition and nanolithography, Sputtering, Pulsed Laser Deposition and Spin Coating as well as lift-off and RIE facilities for lithography, profilometry, Atomic / Magnetic Force Microscopy, SQUID and Magneto Optical Kerr Effect ( MOKE ) magnetometry, etc.
