For a given thickness of a material, that particular construction's " thermal resistance " and the reciprocal property, " thermal conductance ", can be calculated.
32.
Increasing in thermal conductance, most phonon mediated interfaces ( dielectric-dielectric and metal-dielectric ) have thermal conductances between 80 and 300 MW m " 2 K " 1.
33.
Increasing in thermal conductance, most phonon mediated interfaces ( dielectric-dielectric and metal-dielectric ) have thermal conductances between 80 and 300 MW m " 2 K " 1.
34.
An electron micrograph of the quantum of thermal conductance device, taken by postdoc Keith Schwab and colorized by Roukes, was acquired for the permanent collection of the Museum of Modern Art in 2008.
35.
On the other hand, materials with low thermal conductance, such as polystyrene and alumina, are used in building construction or in furnaces in an effort to slow the flow of heat, i . e . for insulation purposes.
36.
It is found that these two parameters can be derived independently based on the delay times, with short delay times ( 0.1-. 5 ns ) resulting in the thermal conductivity and longer delay times ( > 2ns ) resulting in the thermal conductance.
37.
While this idea was first proposed in 1936, The first major model for heat transfer at interfaces was the acoustic mismatch model which predicted a T " 3 temperature dependence on the interfacial resistance, but this failed to properly model the thermal conductance of helium interfaces by as much as two orders of magnitude.
38.
This ability is associated with this bat s high thermal conductance ( C f ) which is defined as the total heat loss less the heat loss due to evaporation divided by body temperature less the ambient temperature ( C f = [ H 1 H e ] / [ T b T a ] ).
39.
One may observe that the heat flow is directly related to the thermal conductivities of the bodies in contact, k _ A and k _ B, the contact area A, and the thermal contact resistance, 1 / h _ c, which, as previously noted, is the inverse of the thermal conductance coefficient, h _ c.
40.
Accordingly spinifex pigeons generally occur is close proximity to permanent water sources . Spinifex pigeon coming in to drink from a stock watering pointThe ability of the spinifex pigeon to withstand high ambient temperatures is a combination of low body heat production, the ability to increase non-evaporative heat loss by hyperthermia and elevated dry thermal conductance, and a relatively high evaporative water loss.
