| 1. | The Low Cost Flip Chip Consortium is a recent example.
|
| 2. | The object is to flip chips so that their pictures are right side up.
|
| 3. | In flip chip systems the IC is connected by solder bumps to a substrate.
|
| 4. | Processing a flip chip is similar to conventional IC fabrication, with a few additional steps.
|
| 5. | Flip chips don't require wire bonding, but he said his wire bonding business will survive.
|
| 6. | He predicted that so-called " flip chip " technology " is about to take off ."
|
| 7. | He said he expects flip chip equipment to become a major business for Kulick & Soffa.
|
| 8. | The venture will be called Flip Chip Technologies.
|
| 9. | He said he expects flip chip equipment to become a major business for Kulick & AMP; Soffa.
|
| 10. | SiP solutions may require multiple packaging technologies, such as flip chip, wire bonding, wafer-level packaging and more.
|