This scheme prohibits dislocation pile-up and instead results in grain boundary diffusion.
2.
This enhances grain boundary diffusion and migration as well as densification of the material.
3.
Densification is only achieved at temperatures above 1800 �C once grain boundary diffusion mechanisms become active.
4.
Diffusion processes caused by electromigration can be divided into grain boundary diffusion, bulk diffusion and surface diffusion.
5.
The " grain boundary diffusion " terms the free migration of atoms in free atomic lattice spaces.
6.
Grain boundary diffusion is significant in face centered cubic metals below about 0.8 T melt ( Absolute ).
7.
In general, grain boundary diffusion is the major electromigration process in aluminum wires, whereas surface diffusion is dominant in copper interconnects.
8.
In general, surface diffusion occurs much faster than grain boundary diffusion, and grain boundary diffusion occurs much faster than lattice diffusion.
9.
In general, surface diffusion occurs much faster than grain boundary diffusion, and grain boundary diffusion occurs much faster than lattice diffusion.
10.
Atomic diffusion in polycrystalline materials is therefore often modeled using an effective diffusion coefficient, which is a combination of lattice, and grain boundary diffusion coefficients.
