| 1. | 6 is the sequence of solder paste height measurements defined
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| 2. | Soldering pastes - part 1 : composition , technical specifications
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| 3. | Reflow solder paste in 2 hours as soon as possible after printing
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| 4. | The operator should use the solder paste quickly after it has been taken out
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| 5. | 7 is the average and range of solder paste height measurements spc controlled
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| 6. | Requirements for soldering paste
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| 7. | Familiar with lead - free solder paste and at least 3 years related sales experience
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| 8. | To achieve the required bump heights , the solder paste is over - printed onto the wafer bond pads
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| 9. | 8 are lcd ' s and ucla ' s defined for the average and range of solder paste measurements
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| 10. | On the other hand it is a wrong way of opening the cover frequently or not covering the solder paste
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