glass frit वाक्य
उदाहरण वाक्य
मोबाइल
- The bonding temperature needs to be high enough to reduce the viscosity of the glass material and ensures a good wetting of the bond surface, but also low enough to prevent overspreading of the glass frit material.
- Wafer-level packaging is implemented before wafer dicing, as shown in Fig . 3 ( a ), and is based on anodic, metal diffusion, metal eutectic, glass frit, polymer adhesive, and silicon fusion wafer bonding.
- Glass frit bonding can be used for many surface materials, e . g ., silicon with hydrophobic and hydrophilic surface, silicon dioxide, silicon nitride, aluminium, titanium or glass, as long as the CTE are in the same range.
- This low melting glass paste is milled into powder ( grain size 2 Al 3 [ AlSi 5 O 18 ] ) or barium silicate, are added to the melted glass paste to influence properties, i . e . lowering the mismatch of thermal expansion coefficients between silicon and glass frit.
- अधिक वाक्य: 1 2
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